EFFICIENT THERMAL CONDUCTIVITY: The Thermal Pad based on silicone and a special filler offers a conductivity of 6.0 W/mK, outperforming generic pads
FILLING THE GAPS: Due to its low hardness and compressibility it works as the perfect gap filler, bridging uneven surface & gaps without any problems
SAFE HANDLING: Does not contain metallic particles, is electrically isolating & not capacitive. Contact with electrical traces does not cause damage
Model: ACTPD00013A
Brand Name
: ARCTIC
| Brand | ARCTIC |
|---|---|
| Model | ACTPD00013A |
| Date First Available | 21-Mar-23 |
Premium Zinc Oxide based thermal compound for optimal thermal performance.
Install new, or replace existing, thermal compound on your CPU and GPU to improve heat transfer and lower temperatures.
Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.
CORSAIR TM30’s low-viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer.
Once installed, CORSAIR TM30’s high-stability liquid compound lasts for years with no drying, cracking or change in consistency.
Non-conductive, non-toxic and contains zero volatile compounds.
Keep your high-end CPU, GPU, or console cool with premium thermal paste that effectively transfers heat between your processor and cold plate.
Low viscosity means XTM70 spreads evenly and cleanly with the included applicator kit, for easy application and peak thermal transfer on an Intel® or AMD® CPU or AIO cold plate.
Wipe away old paste from your processor and AIO cold plate with three included cleaning wipes.
Ideal for high-performance processors up to 250W TDP and higher.
Contains more than enough for multiple applications.
For worry-free use with electrical components.
Convenient 1.0 gram syringe, making this thermal paste very easy to apply
Delivers optimal heat transfer for larger-scale cooling systems, including water cooled systems
Designed with extremely demanding applications
Popular choice for overclockers and extreme gamers
Thermal conductivity 12.5 W/mk
High Thermal Conductivity
Low Thermal Resistance
Long-Term Stability
Low Dry-Out
Non-Corrosive
Electrically Non-Conductive
No “burn-in” time required
