EFFICIENT THERMAL CONDUCTIVITY: The Thermal Pad based on silicone and a special filler offers a conductivity of 6.0 W/mK, outperforming generic pads
FILLING THE GAPS: Due to its low hardness and compressibility it works as the perfect gap filler, bridging uneven surface & gaps without any problems
SAFE HANDLING: Does not contain metallic particles, is electrically isolating & not capacitive. Contact with electrical traces does not cause damage
Model: ACTPD00013A
Brand Name
: ARCTIC
| Brand | ARCTIC |
|---|---|
| Model | ACTPD00013A |
| Date First Available | 21-Mar-23 |
Premium-grade thermal compound for optimal heat-transfer from the CPU or GPU to the heatsink; second generation of Noctuas award-winning NT-H1
Easy to apply (no need to spread before heatsink installation) and easy to clean with supplied NA-CW1 cleaning wipes
For air and liquid coolers (DIY/AiO), can significantly lower temperatures compared to stock pastes on AMD Ryzen and Intel Core CPUs, AMD Radeon and Nvidia GeForce GPUs, PS4/PS5, Xbox, laptops, etc.
Trusted Noctua quality with excellent long-term stability: recommended storage time up to 3 years, recommended usage time on the CPU up to 5 years
3.5g pack for around 3-20 applications (depending on CPU size, e.g. ~3 applications for TR4, ~20 for LGA1200); includes 3 NA-CW1 cleaning wipes
Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity
Keep your high-end CPU, GPU, or console cool with premium thermal paste that effectively transfers heat between your processor and cold plate.
Low viscosity means XTM70 spreads evenly and cleanly with the included applicator kit, for easy application and peak thermal transfer on an Intel® or AMD® CPU or AIO cold plate.
Wipe away old paste from your processor and AIO cold plate with three included cleaning wipes.
Ideal for high-performance processors up to 250W TDP and higher.
Contains more than enough for multiple applications.
For worry-free use with electrical components.
Excellent Stability: Zalman STC8 effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity.
Measuring Graduations for convenience: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
Optimum Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips.
East to use and store: Syringe type which is easy to use and rubber-cap prevents liquid content from being hardened over a period of thime when reused
Outstanding Durability and cooling performance: STC 8 can fill up space between the heatsink and CPU to maximize cooling performance
