New Goldshell CK Box II Miner Nervos Network Dual modes 1.54T /260W or 2.1T /400W without psu
New Goldshell CK Box II Miner Nervos Network Dual modes 1.54T/260W or 2.1T/400W without psu
$359.00
New Goldshell CK Box II Miner Nervos Network Dual modes 1.54T/260W or 2.1T/400W without psu
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Bitmain Antminer L3 L3+ L3++ Control Board LTC Electronic product MINING Machine With cable
$74.99
Applicable to: L3, L3+, L3++ (only firmware difference)Firmware: We will flash the official firmware, which is safe and virus-free.
The firmware of L3+ will be flashed by default, if you have other needs, please communicate with us.
Testing: All control boards will be officially tested to ensure their reliability.
More: More other accessories are available for sale, please communicate with us if you need it.
Please note: this model machine is used one condition, but really good quality.Bitmain S19 XP 141Th/s With 3010 watts PSU Incluced Antminer Ready to Shipping
$5,999.00
Model Antminer S19 XP (140Th) from Bitmain mining SHA-256 algorithm with a maximum hashrate of 140Th/s for a power consumption of 3010W.
Manufacturer: Bitmain
Model: Antminer S19 XP (140Th)
Also known as :S19XP
Release: July 2022
Size: 195 x 290 x 400mm
Weight: 14500g
Noise level: 75db
Fan(s): 4
Power: 3010W
Interface: Ethernet
Temperature: 5 – 45 °C
Humidity: 5 – 95 %Bitcoin ASIC Miner L3+ 504M/S 1.6J/MH consumption ratio with PSU Scrypt BM1485 ASIC Chip Litecoin Miner LTC DOGE Antminer Mining Machine better than antminer l3 S9 T9 DR3 m3
$215.00
L3+ Litecoin Crypto mining machine uses the latest generation BM1485 chip which is independently developed by Bitmain Technologies Ltd.
With TSMCs 28-nanometer FinFET process and a fully customized design solution, the L3+ cryptocurrency mining machine is capable of reaching a much higher efficiency rating while also using less power low-energy. The energy consumption ratio of this device is 1.6J/MH
Double front and rear fans, independent heat sink, allows for better heat dissipation
High-Grade aluminum alloy chassis with integrally formed surroundings
Each chip has an independent heat sink, meaning that the overall structure is more compact
The heat sink adopts a new bonding technology to make the body more robust
