The Gelid Solutions TP-VP05-D is an advanced thermal pad designed to maximize heat dissipation in high-performance electronic devices. Ideal for CPUs, GPUs, and other temperature-sensitive components, this thermal pad offers outstanding thermal conductivity, ensuring efficient heat transfer and superior cooling performance. The flexible, easy-to-cut material ensures a perfect fit on various surfaces, making installation quick and straightforward. The TP-VP05-D is non-conductive and non-corrosive, providing safe and reliable operation without the risk of short circuits or component damage. Its durable construction ensures long-lasting performance, maintaining optimal thermal conditions over extended use.
Gelid Solutions TP-VP05-D GP-Extreme 12W-Thermal Pad 120x20x2.0 (2pcs) Excellent Heat Conduction, Ideal Gap Filler.
$12.99
ULTIMATE THERMAL CONDUCTIVITY: With a thermal conductivity of 12W / mK, the GP-EXTREME offers first-class performance.
SIMPLE APPLICATION: Thanks to its thermal dimensions of 120x20mm, the GP-EXTREME is easy to use.
NON-ELECTRIC CONDUCTIVITY: The GP-EXTREME is not electrically conductive, non-corrosive, non-hardening and non-toxic.
PERFECT SIZES: The GP EXTREME sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
AVAILABILITY OF THE THIN: The GP-EXTREME is available in different thicknesses of 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0mm.
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High Performance: Utilizes nanoparticles for superior heat conductivity for your CPU or GPU
Exceptional Thermal Conductivity: K value of 14W/mK handles even the most extreme system builds
Anhygroscopic (non moisture absorbent): Electrically insulated and non-moisture absorbent properties to protect your CPU
Easy Application: Viscously balanced formula allows for easy application and clean up
Non Corrosive Formula: Non corrosive and oxidation resistant properties leave metal surfaces unharmed and does not solidify
Stable Performance: Versatile range of temperature performance, maintaining stability from -50°C up to 250°CCORSAIR XTM70 Extreme Performance Thermal Paste, 3g
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Keep your high-end CPU, GPU, or console cool with premium thermal paste that effectively transfers heat between your processor and cold plate.
Low viscosity means XTM70 spreads evenly and cleanly with the included applicator kit, for easy application and peak thermal transfer on an Intel® or AMD® CPU or AIO cold plate.
Wipe away old paste from your processor and AIO cold plate with three included cleaning wipes.
Ideal for high-performance processors up to 250W TDP and higher.
Contains more than enough for multiple applications.
For worry-free use with electrical components.Zalman STC 9 Thermal Compound Paste for All CPU Cooler, 4g, Heat Sink Paste, Composed of Carbon Micro-Particles, East to Apply, High Durability, 4g
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Excellent Stability: Zalman STC 9 effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity.
Measuring Graduations for convenience: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
Optimum Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips.
East to use and store: Syringe type which is easy to use and rubber-cap prevents liquid content from being hardened over a period of time when reused
Outstanding Durability and cooling performance: STC 9 can fill up space between the heatsink and CPU to maximize cooling performance &RoHS Certified.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink
$11.99 – $14.99
Provide optimal heat transfer between CPU and heatsink through a metal oxide compound
1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink C Thermal CPU Paste C Heat Sink Paste C Reseal-able syringe applicator
