The GP-Extreme 120×120 Thermal Pad is designed to offer a perfect thermal interface to transfer heat to heatsink when installed on PCBs with height differences and uneven surfaces such as micro-controller units, memory ICs, analog ICs, MOSFETs, and other SMD components. Thanks to its softness and ultimate thermal conductivity the GP-Extreme fills spaces properly and offers the best performance in class.
Gelid Solutions TP-GP01-S-E GP-Extreme 12W-Thermal Pad 120x120x3.0 Excellent Heat Conduction, Ideal Gap Filler
$34.94
Ultimate Heat Conductivity
Non-Electrical Conductive
Non-Corrosive, Non-Curing & Non-Toxic
Easy Application
Perfect for RAM Memory, VRM & M.2 Type SSD
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Noctua NT-H2 3.5g, Thermal Computer Paste incl. 3 Cleaning Wipes (3.5g)
$16.90 – $33.95
Premium-grade thermal compound for optimal heat-transfer from the CPU or GPU to the heatsink; second generation of Noctuas award-winning NT-H1
Easy to apply (no need to spread before heatsink installation) and easy to clean with supplied NA-CW1 cleaning wipes
For air and liquid coolers (DIY/AiO), can significantly lower temperatures compared to stock pastes on AMD Ryzen and Intel Core CPUs, AMD Radeon and Nvidia GeForce GPUs, PS4/PS5, Xbox, laptops, etc.
Trusted Noctua quality with excellent long-term stability: recommended storage time up to 3 years, recommended usage time on the CPU up to 5 years
3.5g pack for around 3-20 applications (depending on CPU size, e.g. ~3 applications for TR4, ~20 for LGA1200); includes 3 NA-CW1 cleaning wipesIceberg Thermal FUZEIce Plus Thermal Paste Heatsink Compound CPU GPU High Performance Grease (3.5g)
$8.99 – $399.00
Easy Application – Built in Applicator/Spreader ensures Simple and Accurate Placement
Premium Performance – High Thermal Conductivity (13 W/mK) and Heat Transfer for Superior Clock Speeds
Safe to Use – Non Electrically Conductive formula Protects against short circuits
Wide Compatibility – Significantly Reduces Temperatures for CPU, GPU, Xbox, PS4/PS5 and more
Long Lasting – Proprietary Formula Lasts for Years without Corroding or Drying OutZalman STC 9 Thermal Compound Paste for All CPU Cooler, 4g, Heat Sink Paste, Composed of Carbon Micro-Particles, East to Apply, High Durability, 4g
$7.99
Excellent Stability: Zalman STC 9 effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity.
Measuring Graduations for convenience: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
Optimum Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips.
East to use and store: Syringe type which is easy to use and rubber-cap prevents liquid content from being hardened over a period of time when reused
Outstanding Durability and cooling performance: STC 9 can fill up space between the heatsink and CPU to maximize cooling performance &RoHS CertifiedGelid Solutions GC-4-1g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity
$7.54
Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity
