TP-GP01-S-C is a thermal pad from Gelid Solutions, specifically part of their GP-Extreme series. This thermal pad measures 120mm x 120mm and has a thickness of 1.5 mm. It is designed to provide a high-quality thermal interface for transferring heat to a heatsink when applied to PCBs with varying heights and uneven surfaces, such as micro-controller units, memory ICs, analog ICs, MOSFETs, and other SMD components. The TP-GP01-S-C thermal pad is known for its softness, exceptional thermal conductivity of 12.0 W/mK, and its ability to effectively fill spaces, ensuring optimal performance.
It is important to remove the protective films from both sides before application, as once the thermal pad is installed, it becomes compressed and deformed, making it non-reusable.
