Bitmain Antminer L7 9050mh Scrypt Algorithm Asic L7 9.05gh L7 Mining the Master of Doge And LTC Include Original Power Supply 3425W 0.36 J/MH Dogecoin Litcoin Miner Mining Equipment
“Bitmain Antminer L3 L3+ L3++ Control Board LTC Electronic product MINING Machine With cable” has been added to your cart. View cart
Bitmain Antminer L7 9050mh Scrypt Algorithm Asic L7 9.05gh L7 Mining the Master of Doge And LTC Include Original Power Supply 3425W 0.36 J/MH Dogecoin Litcoin Miner Mining Equipment
This item is stocked ready to delivery
You will recive it within ONE week.
Hashrate:185MH/s(-5%~+5%)
Wall power:233W(-5%~+5%)
Noise: =35db
Connection: Ethernet/WIFI
Dimension: 175mm*150mm*84mm
Weight:2kg
Currency: LTC&DOGE
Operating Temp:0~35 Celsius degree
Miner Machine Antminer S9 14TH/s Asic miner Come with 2 units Power Supply
1.Power consumption figures will vary with your PSU’s efficiency, the ambient operating temperature and the accuracy of the power meter.
2. Hash Rate: 14TH/s±5%
3. Most Power Efficient Miner in Existence: 93.12 J/TH
4. There are 3 PCI-e connectors for +12V DC input on each hashing board
5. All 3 need to be connected to the PSU for the hash board to operate. Do not connect more than one PSU to the same hashing board!
6. Please note: Antminer S9J this model machine usually require 220V-240V voltage for Running, But Here this link we offer 2 units power supply to support miner work on 110V if you don’t have 220V voltage enviroment
7. Please note: this model machine is refurbished one, really like new one
L3+ Litecoin Crypto mining machine uses the latest generation BM1485 chip which is independently developed by Bitmain Technologies Ltd.
With TSMCs 28-nanometer FinFET process and a fully customized design solution, the L3+ cryptocurrency mining machine is capable of reaching a much higher efficiency rating while also using less power low-energy. The energy consumption ratio of this device is 1.6J/MH
Double front and rear fans, independent heat sink, allows for better heat dissipation
High-Grade aluminum alloy chassis with integrally formed surroundings
Each chip has an independent heat sink, meaning that the overall structure is more compact
The heat sink adopts a new bonding technology to make the body more robust