Accessory USA 6FT 6FEET USB 3.0 Power Charger Data Cable/Cord/Lead Compatible with Mining Machine
Water flow indicator for PC watercooling application
Clear plexi housing with black fins
Connection: for hoses with 6-11mm inner diameter
Silent operation
Dimensions: 88 x 40 x 15mm
D5 pump and pump top combo
Material: acetal
Cable length: 50cm
Pump dimensions (DxH): 60 x 53.5mm
Pump top dimensions: 80 x 80 x 40mm (with stand: 83 x 80 x 87mm)
Hard tube pre-bent to 90 degrees
Material: Plexi (PMMA)
Outer diameter: 13mm (1/2″)
Inner diameter: 10mm (3/8″)
Length: 10 x 30cm
White Exterior Color
G1/4″ Ports (x6)
Material: steel side panels, brass threads, copper chambers, copper fins, copper channels
Weight: 2,173g
Dimensions: 468 x 144 x 60mm
Mounting bracket for the AMD Threadripper with TR4 and TRX40 socket
Compatible with Alphacool Eisbaer CPU AIO Family
Compatible with Alphacool XPX Eisblock CPU Cooler
***** Best Quality Guranteed.
*****PREMIUM QUALITY AND GOOD THERMAL CONDUCTIVITY: This Heatsink is made of high-grade quality aluminum material, which extneds longer service and offers good thermal conductivity
*****16 PCS FINS OFFER MAXIMIZE CONTACTING AREA: Maximize surface area Designed in contact with the cooling air. The 16 pcs fins increase the area of the board and thus provide for greater heat transfer
*****WIDELY APPLICATIONS: This multiple Heat Sink Cooling fins has widely applications, which can be widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc
*****Widely use for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.OFFERS BETTER AND FASTER HEAT DISSIPATING: This Aluminum Heat Sink is designed to reduce the risk of hardware failure due to overheating, which ensures a safety working environment for you
*****ATTENTION: Please make sure that the size of the heat sink fits tha
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
Reduce the risk of hardware failure due to overheating.
Maximize surface area Designed in contact with the cooling air.
Widely used for computer, Power Transistor, IC, LED,
7nm Renoir (Zen 2) 65W
8MB L3 Cache
3MB L2 Cache
AMD Radeon Graphics
7nm 65W
16MB L3 Cache
3MB L2 Cache
None Integrated Graphics