Optimal Thermal Conductivity: Cswur’s CPU Thermal Paste ensures efficient heat transfer, maintaining your computer’s optimal temperature for peak performance.
Long-lasting Durability: Formulated for longevity, this thermal paste provides reliable thermal coupling to safeguard your CPU from overheating, extending the lifespan of your hardware.
Easy Application: With its user-friendly design, applying this thermal paste is hassle-free, ensuring a smooth and even distribution for enhanced heat dissipation.
Wide Compatibility: Compatible with a wide range of CPU models, this thermal paste is a versatile solution for various computer hardware setups.
Professional-Grade Performance: Designed for profe
WIDE APPLICATION: It can be widely used in gaming console ps3/ps4/xbox ,gaming laptops notebooks ,cpu/gpu cooler,graphic cards and electronics motherboards ,led ,pc built etc.
WITH TOOL KIT: The necessary installation tools has been put together with product,you can easily use it when received.

EASY TO SPREAD: The thermal paste with excellent spreading properties,no need to manually spread before installing,it is very easy to use it even for beginners.
SAFETY APPLICATION: The cpu thermal paste is metal-free, non-conductive & non-corroding, there is no risk of short-circuits and it is completely safe to use with any type of CPU cooler and processors.
COMPUTER RESURRECTION: Verified test for the high performance cpu thermal paste,cpu temp will be reduced from 10-20 after installed 8.5W/mK
WIDE APPLICATION: It can be widely used in gaming console ps3/ps4/xbox ,gaming laptops notebooks ,cpu/gpu cooler,graphic cards and electronics motherboards ,led ,pc built etc.
WITH TOOL KIT: The necessary installation tools has been put together with product,you can easily use it when received.

These thermal pads are made from a carbon-based polymer with nanoparticles; They have a high thermal conductivity of 62.5 W/mk
The non-adhesive and flexible carbon thermal padding can be used repeatedly and, unlike pastes, does not dry out
The thermal conductive pad meets the expectations of gamers and IT enthusiasts alike, who are primarily looking for a high quality product from Thermal Grizzly
The thermal pad material is virtually non-degradable, so its properties are solid and its lifespan almost unlimited (rumored to be up to 15 years)
Suitable for CPU cooling, GPU cooling, and any application that requires the use of pads instead of thermally conductive pastes. Carbonaut is an electrical conductor – avoid contact between thermal pad and transistors or transformers

THERMAL CONDUCTIVITY – Extremely high conductivity, perfect for even the most demanding configurations.
ONG ACTION – Conductonaut has high thermal conductivity and is stable even with extended use. However, it CANNOT be used on aluminum components due to the risk of corrosion.
EXEPTIONAL RESUTLS – Using this thermal compound will immediately lower temperatures, reducing equipment noise and improving user comfort.
GREAT VALUE FOR MONEY – Conductonaut is an excellent choice for experienced users who want to enhance their system’s thermals, as it provides up to 10 times more thermal conductivity than other thermal greases.
useable for up to 30 CPUs (depending on diy size)

About this item
Thanks to its excellent thermal conductivity, Hydronaut can be used in the overclocking sector, but it has been specially developed for users with large heatsinks
The convenient syringe makes this Thermal Compound very easy to apply and goes exactly where it should. CPU and cooling, GPU, LEDs, heat dissipating ribbed plates
Thermal Grease perfectly conducts heat, is safe, does not integrate with the processor; Thermal conductivity 11.8 W/Mk Thermal resistance 0.0076 K/W
Compatible not only with computers or laptops, but also with PS3 PS4 or PS5 Xbox 360, One, Series S and X consoles; It perfectly dissipates heat from Macbooks
Thermal paste Hydronaut does not harden and has high long-term stability; The paste does not need hardener, does not contain silicone and does not conduct electricity

EXTREMELY high thermal conductivity of 12.5KW achieved with even smaller particles, is perfect for even the most demanding configurations and can also be used in industrial cooling systems
THERMAL COMPOUND PASTE EASY TO USE – Thanks to a specially constructed syringe and a spatula for spreading thermal grease included. It guarantees a simple, pleasant and precise distribution of the paste on your processor or graphics card
LONG ACTION – Provides long-lasting effect, thanks to its characteristic and specialized structure, Kryonaut thermal paste does not dry out even at 80° Celsius degrees
SURPRISING EFFECTS – Already at the first use of this thermal solution, you may experience a drop in temperature, which will reduce the loudness of your equipment and improve the comfort of use
NUMBER 1 ON THE MARKET – Confirmed by many tests, the most popular choice meets the highest quality standards not only of standard computer users but also of avid Overclocking fans

Graphene thermal pad
No liquid components
0.2mm thickness
38mm x 38mm size
Z-direction stacked molecular structure

33mm x 33mm thermal pad (thickness 0.2mm)
Temperature range from -250 u00b0C to +150 u00b0C
Excellent thermal conductivity
Very easy to use – designed for AMD Socket AM5 and other CPUs/GPUs

50mm x 50mm thermal pad (thickness 0.2mm)
Temperature range from -250 u00b0C to +150 u00b0C
Excellent thermal conductivity
Extreme durability and does not dry out, ever

Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks
Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment
The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat
Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components
Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate