Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks
Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment
The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat
Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components
Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate
The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame that allows for the installation of Ryzen 7000 processors without the integrated heat spreader
The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame that allows for the installation of Ryzen 7000 processors without the integrated heat spreader
Removing the heat spreader (“delidding”) can also improve cooling in gaming PCs, workstations, and silent PCs
Direct-die cooling offers benefits such as direct heat dissipation to the cooler and more efficient heat dissipation
The AMD Ryzen 7000 Direct Die Frame protects the exposed chiplets of the Ryzen 7000 CPU and enables safe installation of the CPU cooler without damaging the sensitive chips
EXCELLENT THERMAL CONDUCTIVITY – They provide outstanding and consistent thermal conductivity, thanks to an optimized molecular structure and innovative manufacturing process
EASY APPLICATION – Easy and convenient to apply, they offer reliable heat dissipation for optimal cooling
CONSISTENT HIGH PERFORMANCE – With their material composition and special manufacturing technique, KryoSheet delivers consistent high performance
EXTREME DURABILITY – Designed for long-lasting durability, the pads oer reliable heat dissipation even under heavy usage
ELECTRICALLY CONDUCTIVE – Please note that KryoSheet pads are electrically conductive and should be used according to the instructions to avoid potential damage
Simplifies the grinding of the AM5 CPU
CNC-milled acrylic glass
Complete set with sandpaper
One-time use
Simplifies CPU sanding
For Intel Core 13th/14th Gen (Compatible with 12th Gen)
CNC-milled acrylic glass
Complete set with sandpaper
Single use recommended
The Thermal Grizzly pad is not only compatible with PCs and laptops, but also with the PS3, PS4, PS5, Xbox 360, One and Series X; It also provides excellent heat dissipation for Macbooks
Based on silicone, PC pad with the consistency of modelling clay is ideally suited between the heatsink and hot components
Improved design over Minus Pad 8 provides approximately 260% more thermal conductivity so that the cooling pad compensates for even the most invisible gaps between components
Designed for office, home and gaming PCs; Also suited for users who require their PC to perform at full speed
Thermo pads are used in places where the use of thermal paste is not possible, e.g. large air gaps or uneven surfaces
Unique 2-Step Process
Removes existing thermal grease or pads
Prepares surface for fresh applications
Excellent Stability: Zalman STC 7 effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity.
Measuring Graduations for convenience: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
Optimum Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips.
East to use and store: Syringe type which is easy to use and rubber-cap prevents liquid content from being hardened over a period of time when reused
Outstanding Durability and cooling performance: STC 7 can fill up space between the heatsink and CPU to maximize cooling performance &RoHS Certified
Excellent Stability: Zalman STC 9 effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity.
Measuring Graduations for convenience: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
Optimum Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips.
East to use and store: Syringe type which is easy to use and rubber-cap prevents liquid content from being hardened over a period of time when reused
Outstanding Durability and cooling performance: STC 9 can fill up space between the heatsink and CPU to maximize cooling performance &RoHS Certified
Excellent Stability: Zalman STC8 effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity.
Measuring Graduations for convenience: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
Optimum Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips.
East to use and store: Syringe type which is easy to use and rubber-cap prevents liquid content from being hardened over a period of thime when reused
Outstanding Durability and cooling performance: STC 8 can fill up space between the heatsink and CPU to maximize cooling performance