Optimal Thermal Conductivity: Cswur’s CPU Thermal Paste ensures efficient heat transfer, maintaining your computer’s optimal temperature for peak performance.
Long-lasting Durability: Formulated for longevity, this thermal paste provides reliable thermal coupling to safeguard your CPU from overheating, extending the lifespan of your hardware.
Easy Application: With its user-friendly design, applying this thermal paste is hassle-free, ensuring a smooth and even distribution for enhanced heat dissipation.
Wide Compatibility: Compatible with a wide range of CPU models, this thermal paste is a versatile solution for various computer hardware setups.
Professional-Grade Performance: Designed for profe
WIDE APPLICATION: It can be widely used in gaming console ps3/ps4/xbox ,gaming laptops notebooks ,cpu/gpu cooler,graphic cards and electronics motherboards ,led ,pc built etc.
WITH TOOL KIT: The necessary installation tools has been put together with product,you can easily use it when received.

These thermal pads are made from a carbon-based polymer with nanoparticles; They have a high thermal conductivity of 62.5 W/mk
The non-adhesive and flexible carbon thermal padding can be used repeatedly and, unlike pastes, does not dry out
The thermal conductive pad meets the expectations of gamers and IT enthusiasts alike, who are primarily looking for a high quality product from Thermal Grizzly
The thermal pad material is virtually non-degradable, so its properties are solid and its lifespan almost unlimited (rumored to be up to 15 years)
Suitable for CPU cooling, GPU cooling, and any application that requires the use of pads instead of thermally conductive pastes. Carbonaut is an electrical conductor – avoid contact between thermal pad and transistors or transformers

High-performance thermal paste: Conductonaut Extreme delivers exceptional heat transfer and cooling capabilities, ideal for overclockers and high-performance systems.
Liquid metal-based formula: Composed of a eutectic alloy, this advanced thermal paste offers enhanced thermal conductivity and long-term stability compared to conventional thermal pastes.
Impressive thermal conductivity: With a thermal conductivity, Conductonaut Extreme outperforms silicone-based and other alternative thermal pastes.
Easy application: The liquid metal paste is simple to apply, and the manufacturer includes the necessary accessories for a hassle-free experience.
Highly efficient: One gram of Conductonaut Extreme is sufficient for more than 10 applications, making it an economical choice for those seeking optimal cooling performance.

THERMAL CONDUCTIVITY – Extremely high conductivity, perfect for even the most demanding configurations.
ONG ACTION – Conductonaut has high thermal conductivity and is stable even with extended use. However, it CANNOT be used on aluminum components due to the risk of corrosion.
EXEPTIONAL RESUTLS – Using this thermal compound will immediately lower temperatures, reducing equipment noise and improving user comfort.
GREAT VALUE FOR MONEY – Conductonaut is an excellent choice for experienced users who want to enhance their system’s thermals, as it provides up to 10 times more thermal conductivity than other thermal greases.
useable for up to 30 CPUs (depending on diy size)

Thermal conductivity: 12.5 W/ m · K
Viscosity: 120 to 170 pas
Heat resistant Temperature: -200 ° C to 350 ° C
Color: light Gray
Volume: 3 ml (11.1 g)

29mm x 25mm thermal pad (thickness 0.2mm)
Temperature range from -250 u00b0C to +150 u00b0C
Excellent thermal conductivity
Very easy to use
Extreme durability and does not dry out, ever

33mm x 33mm thermal pad (thickness 0.2mm)
Temperature range from -250 u00b0C to +150 u00b0C
Excellent thermal conductivity
Very easy to use – designed for AMD Socket AM5 and other CPUs/GPUs

Single thermal pad with dimensions of 100mm x 100mm
Thickness of 0.5mm
Highly elastic and flexible surface area and ultra-high thermal conductivity

Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks
Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment
The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat
Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components
Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate

Single thermal pad with dimensions of 30mm x 30mm
Thickness of 2.0mm
Highly elastic and flexible surface area and ultra-high thermal conductivity
Engineered in Germany by Thermal Grizzly

Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks
Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment
The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat
Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components
Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate

The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame that allows for the installation of Ryzen 7000 processors without the integrated heat spreader
The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame that allows for the installation of Ryzen 7000 processors without the integrated heat spreader
Removing the heat spreader (“delidding”) can also improve cooling in gaming PCs, workstations, and silent PCs
Direct-die cooling offers benefits such as direct heat dissipation to the cooler and more efficient heat dissipation
The AMD Ryzen 7000 Direct Die Frame protects the exposed chiplets of the Ryzen 7000 CPU and enables safe installation of the CPU cooler without damaging the sensitive chips

Simplifies CPU sanding
For Intel Core 13th/14th Gen (Compatible with 12th Gen)
CNC-milled acrylic glass
Complete set with sandpaper
Single use recommended

The Thermal Grizzly pad is not only compatible with PCs and laptops, but also with the PS3, PS4, PS5, Xbox 360, One and Series X; It also provides excellent heat dissipation for Macbooks
Based on silicone, PC pad with the consistency of modelling clay is ideally suited between the heatsink and hot components
Improved design over Minus Pad 8 provides approximately 260% more thermal conductivity so that the cooling pad compensates for even the most invisible gaps between components
Designed for office, home and gaming PCs; Also suited for users who require their PC to perform at full speed
Thermo pads are used in places where the use of thermal paste is not possible, e.g. large air gaps or uneven surfaces