Mfr Part Number: AS5- 3.5G x 10-> Pack of 10 units.
Features: Contains 99.9 % pure silver High-Density(contains over 88% thermally conductive filler by weight) Controlled Tripple-Phase Viscosity Not Electrically Conductive and Absolute Stability (will not separate run migrate or bleed).
Thermal Conductance: >300000W/m2 C ( 0.001 inch layer).
Thermal Resistance: < 0.005C -in2/Watt ( 0.001 inch layer).
Average Particle Size: < 0.49 microns 180C
Long-Term: 50C to 130C.
Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core..
Coverage Area: The 3.5 gram tube contains enough compound to cover at least 15 to 25 small CPU cores or 6 to 10 large CPU cores or 2 to 5 heat plates. At a layer 0.003 thick the 3.5 gram tube will cover approximately 16 square inches.