The TP-GP01-S-B is a thermal pad from Gelid Solutions, specifically part of their GP-Extreme series. This thermal pad is 120mm x 120mm in size and has a thickness of 1.0 mm. It is engineered to offer an optimal thermal interface for transferring heat to a heatsink when mounted on PCBs with varying heights and uneven surfaces like micro-controller units, memory ICs, analog ICs, MOSFETs, and other SMD components. The GP-Extreme thermal pad is recognized for its softness, exceptional thermal conductivity, and its ability to effectively fill spaces, ensuring top-notch performance.
It is crucial to remove the protective films from both sides before application, as once the thermal pad is applied, it becomes compressed and deformed, making it non-reusable.