The high performance thermal pads of the Thermal Grizzly Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating for even the smallest of gaps between components.
The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide. Thus, the pads ensure a constant, optimal heat transfer.
The lightest of touches is enough to attach them optimally.
Thermal Grizzly Minus Pad is a thermal pad made of modified silicone. The silicone is filled with metal oxides, ensuring remarkable thermal conductivity. Best suited for electrical components such as PCs, notebooks, LED or LCD devices, semiconductors or transformers. It is also used for RAM, CPUs or GPUs. In general, it can be used for any component that uses a metal housing as a heat sink.
