Specific Gravity: 2.7g/cm³
Adhesiveness: 330000 Cps
Thermal Conductivity: 11.2 W/m-?
Thermal Impedance: 0.013 ?-in²/W
Material Specification: Substance name content
Al 70~88 (wt%)
ZnO 18~34 (wt%)
Oil 8~12 (wt%)
Antioxidant 0.5~2 (wt%)
Like two hot lovers, a heatsink and the processor want to make full contact. But microscopic imperfections in their craftsmanship create small gap for air. These gaps act as thermal insulators, inhibiting the transfer of thermal energy from your components.
PK-3 thermal compound is made up of specially designed nano particles, engineered to correct these imperfections. The nano particles work by filling in the small air gaps and allowing for peak transfer of heat away from your components.
